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Cu-11.5%Fe合金的导电性

Conductivity of Cu-11.5%Fe alloys

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【作者】 姚再起葛继平刘书华李海山李明生

【Author】 YAO Zai-qi, GE Ji-ping, LIU Shu-hua, LI Hai-shan, LI Ming-sheng (School of Materials Science and Engineering, Dalian Jiaotong University, Dalian 116028, China)

【机构】 大连交通大学材料科学与工程学院大连交通大学材料科学与工程学院 大连116028大连116028大连116028

【摘要】 研究了Cu 11.5%Fe合金经固溶和时效处理后导电性的变化规律。采用SEM和TEM观察了经不同规范热处理Cu 11.5%Fe合金的组织结构,利用XRD测定了铜基体的晶格常数,得出时效处理对合金电阻率的影响规律,并探讨了合金电阻率变化的内在原因。结果表明:影响合金导电性的主要因素是溶质散射电阻、析出应变场散射电阻;固溶处理的合金经过550℃、2h时效处理,可得到较低的电阻率。

【Abstract】 The effect of aging treatment on conductivity of Cu-11.5%Fe alloys was studied. The microstructures of Cu-11.5%Fe alloys after different aging treatment were studied by transmission electron microscope (TEM) and scanning electron microscope(SEM). The lattice parameter of Cu matrix was measured by X-ray diffraction (XRD). The effect of aging on resistivity was obtained and the internal reason of resistivity change was discussed. The results show that the resistivity of Cu-Fe alloys are contributed mainly by the Fe impurity scattering and the scattering associated with strain fields of Fe precipitates. Cu-11.5%Fe alloys present favourite conductivity after aging at (550 ℃) for 2 h .

【关键词】 Cu11.5%Fe合金时效处理电阻率
【Key words】 Cu-11.5%Fe alloysagingresistivity
【基金】 大连科技计划资助项目(2002A1GX024)
  • 【文献出处】 中国有色金属学报 ,The Chinese Journal of Nonferrous Metals , 编辑部邮箱 ,2004年11期
  • 【分类号】TG131
  • 【被引频次】19
  • 【下载频次】214
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