【摘要】 采用ST50润湿实验仪完成了钎焊并研究分析了Sn 9Zn 3Bi/Cu接头在170℃下长期时效的显微结构变化。结果表明:Sn 9Zn 3Bi/Cn接头时效至200h后在界面处形成单一连续的Cu5Zn8化合物层;时效至500h和1000h后,界面处形成了3层化合物层,从铜母材侧起,分别为Cu Sn化合物层,Cu Zn化合物层和Sn Cu化合物层;随着时效时间的增加,整个金属化合物层变厚,而Cu Zn化合物层减薄,表明Cu Zn化合物层在时效过程中具有不稳定性。更多还原

【Abstract】 Soldering process was performed by wetting test machine ST50. The microstructures of Sn-9Zn-3Bi/Cu joint were investigated under 170 ℃ thermal exposure conditions. The results show that a continuous single layer of Cu₅Zn₈ intermetallic compound appears when aging within 200 h and three layers are formed after aging for 500 h and 1 000 h. From the Cu substrate, they are Cu-Sn layer, Cu-Zn layer, Sn-Cu layer, respectively. The total intermetallic compound layers thicken while the thickness of Cu-Zn compound layer decreases with increasing exposure time. It indicates that the Cu-Zn compounds are not stable during long-term aging.更多还原