【摘要】 利用喷射成形技术制备了60Si40Al合金新型电子封装材料。研究了各工艺参数对沉积坯件的影响,确定了较佳工艺参数。研究了材料的显微组织以及沉积态合金在加热保温过程中的组织转变规律,确定了热等静压温度,进行了热等静压致密化处理。研究结果表明:材料显微组织细小,一次硅相尺寸约为10μm,且均匀弥散分布,该材料的热膨胀系数为9×10-6～10×10-6/K,热导率约为110W/(m·K),是一种理想的电子封装材料。更多还原

【Abstract】 A novel 60Si40Al alloy packaging material for electronic applications was prepared by spray forming technology. The effect of parameter upon performs, the microstructures produced from spray forming process, and the hot isostatic pressing（HIP） process were studied. The results show that Si phase is fine and dispersion, the microstructure of performs from spray forming is fine and uniform, the thermal expansivity（CTE） is about 9×10^-6～10×10^-6/K, and the thermal conductivity is about 110W/（m·K）.更多还原