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a-C:F薄膜的工艺及热稳定性研究

Study on the Thermal Stability and Fabrication Techniques of a-C:F Thin Film

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【作者】 李幼真; 刘雄飞; 肖剑荣; 张云芳;

【Author】 LI You-zhen, LIU Xiong-fei, XIAO Jian-rong, ZHANG Yun-fang (School of Physics Science and Technology, Central South University, Changsha 410083,China)

【机构】 中南大学物理科学与技术学院; 中南大学物理科学与技术学院 湖南 长沙 410083; 湖南 长沙 410083; 湖南 长沙 410083;

【摘要】 以CF4和CH4为源气体,用PECVD法制备了不同沉积条件下的a C:F薄膜,测量了薄膜的厚度,研究了薄膜沉积速率和沉积工艺的关系,用傅立叶变换红外谱(FTIR)分析了薄膜的化学键结构,用扫描电镜和原子力显微镜分析了薄膜表面形貌,对薄膜在真空中进行了退火,研究了薄膜的热稳定性。实验表明,沉积速率在5~8nm/min之间,薄膜表面平整、致密,在300℃内有较好的热稳定性。

【Abstract】 Using CF4 and CH4 as the source gases, a-C:F thin films were fabricated by PECVD method in different depositions conditions. The thickness of films was measured, and the relations between deposition rate and fabrication conditions were investigated. The chemical bonding structures were analyzed by FTIR, the surface morphologies of the thin films were studied by SEM and AFM. After vacuum annealing process, the thermal stability of the film was investigated. The results indicated that the films fabricated with deposition rate between 5 and 8 nm per minute had a flat surface and a good thermal stability up to 300 ℃.

【关键词】 PECVD; 沉积速率; a-C:F薄膜; 表面形貌;
【Key words】 PECVD; Deposition rate; a-C:F thin film; Surface morphologies;
  • 【文献出处】 真空电子技术 ,Vacuum Electronics , 编辑部邮箱 ,2004年03期
  • 【分类号】O484
  • 【被引频次】3
  • 【下载频次】44
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