【摘要】 根据SMT焊点质量与焊点的三维几何形态直接相关的特点 ,提出了SMT焊点形态理论。以该理论为支持 ,提出了SMT焊点质量模糊诊断技术。将实际焊点几何形态与合理焊点几何形态对应比较 ,作为模糊输入向量 ,以焊点的故障缺陷发生可能度作为模糊输出向量。通过可信度约束的模糊规则与正反向模糊推理 ,进行焊点质量模糊故障诊断。以四边扁平封装器件 (QFP)为例 ,进行了实例验证更多还原

【Abstract】 According to the characteristics that SMT solder joint quality is related to its 3-D geometrical shape directly, theory of solder joint shape was put forward. On the basis of this theory, SMT solder joint quality fuzzy diagnosis technology was studied. Firstly, the actual solder joint geometrical shapes were compared with the reasonable data, then the results were taken as the fuzzy input vectors and possibility of solder joint disfigurement was taken as the fuzzy output vector. The solder joint quality can be diagnosed through fuzzy principle and fuzzy inference forward and back. Finally, an example of quad flat pack(QFP) is analyzed to testify its correctness.更多还原