【摘要】 随着集成电路 (IC)制造技术的飞速发展 ,为了进一步增加 IC芯片的产量和降低单元制造成本 ,硅片趋向大直径化。高质量、大尺寸硅片的制造对超精密加工技术提出了更加严峻的挑战。简要地介绍了传统的及目前流行的硅片加工工艺 ,讨论了在线电解修整 (EL ID)辅助磨抛硅片技术 ;最后 ,针对固结磨具中存在的超细磨料团聚问题 ,介绍了几种新型的磨抛盘制备技术更多还原

【Abstract】 With the fast development of IC manufacturing technology, the diameter of the silicon wafer trends to be larger in order to increase the yields of chips and reduce the cost per bit. It is a big challenge to the manufacturing of the high-quality and large-scale silicon wafers. In this paper, the conventional machining process and the machining process of large-scale silicon wafer are introduced briefly. The grinding technology of silicon wafer assisted by ELID is discussed and several manufacturing technologies of new-style grinding discs for solving the inhomogeneous aggregation of ultra-fine abrasives are introduced.更多还原