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电子封装用SiC_p/ZL101复合材料热膨胀性能研究
Study on Thermal Expansion of SiC Particulate Reinforced ZL101 Composite for Electronic Packaging
【摘要】 采用无压渗透法制备了SiCp/ZL10 1复合材料 ,测定了SiCp/ZL10 1复合材料在 2 5℃~ 4 0 0℃区间的线膨胀系数值 ,运用理论模型对复合材料的线膨胀系数进行了计算 ,分析了热膨胀性能的影响因素。结果表明 ,复合材料的线膨胀系数比基体合金显著降低 ,Turner模型对SiCp/ZL10 1复合材料线膨胀系数的计算值与实验值相接近 ,复合材料热应力引起线膨胀性能的变化随温度的不同而不同
【Abstract】 SiC p/ZL101 composite is prepared by use of pressureless infiltration. The coefficients of thermal expansion (CTE)of SiC p/ZL101 composites are measured at temperature range of 25℃ to 400℃. Theoretical models are employed to calculate the CTE of SiC p/ZL101. The influence factors on thermal expansion property are analyzed. The results show that the CTE of the composite decreases apparently by comparison with the CTE of its matrix alloy. The CTE calculated by Turner model is close to the experimental values. The influence of thermal stress on CTE depends on temperature.
【Key words】 Electronic packaging; SiC p/ZL101 composite; CTE; Thermal stress;
- 【文献出处】 宇航材料工艺 ,Aerospace Materials & Technology , 编辑部邮箱 ,2004年04期
- 【分类号】TN304
- 【被引频次】14
- 【下载频次】227