【摘要】 提出了电子束真空辐射固化技术新概念,并对该技术的固化机理等进行了阐述。通过对液态低聚物辐射固化条件和SDS-II型曝光机的加速电压、曝光剂量等曝光参数的分析研究,得出SDS-II型曝光机可以用于液态低聚物辐射固化的结论。在此基础上使用SDS-II型曝光机在20kV的加速电压、2μC/cm2的曝光剂量下,对经真空挥发处理过的三羟甲基丙烷三丙烯酸酯(TMPTA)液态低聚物进行了曝光试验,得到了固化结构。基本上证明了电子束真空辐射固化液态低聚物的可行性,为微机电三维微结构的加工提供了一种新方法。更多还原

【Abstract】 A novel technology, electron beam curing in vacuum, and its curing mechanism are presented. Based on the studies of oligomer curing conditions and accelerating voltage, exposure dose of SDS-II electron beam exposure system, a conclusion is achieved that SDS-II is suitable for curing oligomer. An experiment has been made to cure oligomer Trihydroxy Methyl Propane Tri Acrylate(TMPTA) in SDS-II at (20 kV) and 2 _C/cm~2 dose. A cured structure was made. This shows that electron beam curing of oligomer in vacuum is feasible.更多还原