【摘要】 以乙二胺作为扩链剂,合成了一种新型的阻焊剂成膜高分子物质.当选用的光敏酚醛环氧树脂(环氧值为0.08,1g树脂光敏性双键的物质的量为0.0026mol)与乙二胺的质量比为75∶1,即n环氧基∶n氨基为1.68∶1时,能得到较大相对分子质量的扩链树脂;以扩链树脂作为成膜物质制备的阻焊剂,涂膜后在50℃的真空干燥箱中处理2h,漆膜表面不粘手,预处理时间比扩链前下降了50%;当扩链树脂、三羟甲基丙烷三丙烯酸酯(TMPTA)与异丙基硫杂蒽酮(ITX)/乙基对二甲基胺基苯甲酸酯(EDAB)(1∶2)的质量比为4.1∶1∶0.04时,漆膜具有较好的性能.更多还原

【Abstract】 A new polymer resin used as a kind of special coating solder resist has been synthesized by chain extension reaction of photosensitive acrylic epoxyphenolic resin(AFEE) with ethylenediamine(EDA).A relatively higher relative molecular mass linear polymer is obtained with the mass ratio of AFEE/EDA=75/1(the mol ratio of epoxy group and amino group = 1.68∶1).Surface drying time of coating solder resists from the above polymer resin is only 2 hours in vacuum at 50 ℃ and much less than 6 hours of AFEE.The coating is relatively more effective in resistance to organic solvents,to acids and alkaline,when using the mass ratio of the above resin∶trimethylolpropane triacrylate ∶(isopropylthioanthone　+　2 ethyl4(dimethylamino)benzoate) being as 4.1 ∶1 ∶0.04 to make a novel paint.更多还原