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衬底负偏压对溅射Ta2O5薄膜晶化温度及介电性能的影响
Effect of Substrate Bias on Crystallization Temperature and Dielectric Properties of Sputtered Ta2O5 Films
【摘要】 采用磁控溅射法,在衬底温度为620℃时,通过引入合适的衬底负偏压(100~200V),获得了结晶良好的Ta2O5薄膜,衬底负偏压增强了正离子对衬底表面的轰击作用,加速了其在衬底表面的松弛扩散效应,从而降低了Ta2O5薄膜的晶化温度,改善了其结晶性。同时,C—V测试结果表明:衬底负偏压进一步改善了Ta2O5薄膜的介电性能.
【Abstract】 At the substrate temperature of 620℃, crystalline TaO5 films were sputtered byintroducing suitable negative substrate bias of 100~200V. It was thought that the ion bombard-ment. to the substrate was enhanced with introducing the negative substrate bias. The diffusionand looseness of deposited particles on the surface of substrate were accelerated. Consequently,the crystallization of Ta2O5 films was improved and the crystallization temperature was lowered.Meanwhile, the C-V result indicated that the dielectric properties of Ta2O5 films were furtherimproved by introducing negative Substrate bias.
【Key words】 Ta2O5; dielectric films; crystallization temperature; bias;
- 【文献出处】 无机材料学报 ,Journal of Inorganic Materials , 编辑部邮箱 ,2004年03期
- 【分类号】O484
- 【被引频次】3
- 【下载频次】93