节点文献
Al-4Cu-Mg合金半固态压缩过程中的微观组织演变
Microstructural Evolution of the Semi-solid Al-4Cu-Mg Alloy during Isothermal Comperssion Process
【摘要】 研究了SIMA法制备的半固态Al 4Cu Mg合金在不同变形温度、变形程度和应变速率下压缩变形时的微观组织演变 ,并研究了半固态Al 4Cu Mg合金在高温变形条件下的微观组织形态。研究结果表明 ,在半固态条件下 ,晶粒平均尺寸随变形温度的升高而增大 :从 5 40℃到 5 60℃ ,晶粒平均尺寸增大了 2 %~ 9% ,而从 5 60℃到 5 80℃ ,晶粒平均尺寸增大了3 %~ 16% ,后者的增幅比前者大。变形程度增大 ,晶粒平均尺寸减小 ,同一试样大变形区的晶粒平均尺寸比小变形区的晶粒平均尺寸小 4%~ 15 %。应变速率减小 ,晶粒平均尺寸增大 ,晶粒变得圆整
【Abstract】 Microstructural evolution of the semi-solid Al-4Cu-Mg alloy prepared by SIMA at different deformation temperatures and deformation degree as well as strain rates during isothermal compression process was investigated. Microstructure of the semi-solid alloy under high temperature deformation condition was observed also. The results showed that the average grain size increased by 2%~9% with deformation temperature increase from 540 ℃ to 560 ℃ and increase by 3%~16% from 560 ℃ to 580 ℃ while decreased with deformation degree increase. The average grain size in large deformation area was smaller by 4%~15% than in small deformation area in same specimen. Average grain size increased and grain became round with strain rates reduction.
【Key words】 Semi-solid Al Alloy; Compression Deformation; Microstructure; Grain Size;
- 【文献出处】 特种铸造及有色合金 ,Special Casting & Nonferrous Alloys , 编辑部邮箱 ,2004年06期
- 【分类号】TG111.4;TG146.2
- 【被引频次】10
- 【下载频次】132