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Joint Strength with Soldering of Al2O3 Ceramics After Ni-P Chemical Plating

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【作者】 邹贵生吴爱萍张德库孟繁明白海林张永清黎义巫世杰顾兆旃

【Author】 ZOU Guisheng , WU Aiping , ZHANG Deku MENG Fanming , BAI Hailin ZHANG Yongqing LI Yi , WU Shijie GU Zhaozhan Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China; Aerospace Research Institute of Materials and Processing Technology, Beijing 100076, China

【机构】 Department of Mechanical EngineeringTsinghua UniversityBeijing 100084ChinaAerospace Research Institute of Materials and Processing TechnologyBeijing 100076China

【Abstract】 Ni-P alloy was chemically plated on Al2O3 ceramics to produce uniform alloy coatings at tem- peratures below 70℃. Cu metal was electroplated onto the Ni-P coating to facilitate the soldering and shorten the chemical plating time. Then, the electroplated ceramic specimens were soldered with 60 wt.% Sn-40 wt.% Pb solder in active colophony. The highest shear strength was acquired after the heat treatment at 170℃ for 15 min. The joint fractures mostly propagated along the interface between the ceramics and the Ni-P coating, with some fracture in both the ceramics and the Ni-P coating near the interface and some along the interface between the Cu and Ni-P coatings. The results show that ceramic surface roughness and the chemical plating parameters influence the coating quality, and that suitable heat treatment before the soldering also improves the adhesion between the ceramics and Ni-P coatings, thus strengthening the joints.

【基金】 Supported by the Innovation Foundation of Aerospace Science and Technology of China and the Young Teacher Foundation of the Department of Mechanical Engineering and the Key Laboratory Open Fund of Tsinghua University
  • 【文献出处】 Tsinghua Science and Technology ,清华大学学报(自然科学版英文版) , 编辑部邮箱 ,2004年05期
  • 【分类号】TG457
  • 【被引频次】6
  • 【下载频次】105
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