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Ag对Sn-57Bi无铅钎料组织和性能的影响
Influence of Ag on Microstructure and Mechanical Properties of Sn-57Bi Lead-Free Solder
【摘要】 研究了在Sn 57Bi近共晶合金的基础上加入少量的Ag后对Sn 57Bi钎焊料铸态组织、抗拉强度和Sn 57Bi/Cu焊接性能的影响。试验结果表明,ωAg=0.1%~1.0%可使合金的共晶组织变细,β Sn枝晶相的尺寸变小,提高其抗拉强度;使Sn 57Bi/Cu接头的剪切强度有所提高。
【Abstract】 Based on Sn-57Bi near-eutectic alloy, the effect of Ag addition on the cast microstructure,tensile strength of Sn-57Bi solder and the weldability of Sn-57Bi/Cu were investigated.The experimental result showed that small amount addition of Ag can effectively fine the microstructure,improve the tensile strength of the solder as well as the shearing strength of Sn-57Bi/Cu joint due to the precipitate of intermetallic compound Ag3Sn.
【基金】 河南省高校创新人才基金资助项目(教高2001-513);河南省高校杰出科研人才创新工程项目;河南省高校青年骨干教师资助项目([2002]114)
- 【文献出处】 河南科技大学学报(自然科学版) ,Journal of Luoyang Institute of Technology , 编辑部邮箱 ,2004年03期
- 【分类号】TG425
- 【被引频次】38
- 【下载频次】252