【摘要】 铜基形状记忆合金具有价格低廉、热稳定性好和高温应用前景等优点,然而晶间断裂和晶粒粗大是其目前未得到实用化的技术关键。本文概述了铜合金产生晶间断裂及晶粒粗大的原因,总结了目前该合金的晶粒细化方法及其优缺点,并指出了直流脉冲电场处理是有发展潜力的方法,同时探索了该合金的应用前景。更多还原

【Abstract】 Cu-based shape memory alloys possess low price, good thermal stability and the property of high temperature application. But intergranular crack and grain coarseness are its technology issues retarding practical application. The reasons for intergranular crack and grain coarseness are summarized,the measures of grain-refinement and their merits and faults concluded. It points out the discussed electron pulse modification possesses better development potential, with the application prospects in Cu-based alloys approached and explored.更多还原