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超硬材料合成触媒中铜的分析方法研究

CAS-CTMAB-PHOTOMETRIC DETERMINATION OF COPPER IN THE CATALYST USED IN SYNTHESIS OF SUPER-HARD ABRASIVES

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【作者】 华勇李亚萍蒋登高

【Author】 HUA Yong~(1,2), LI Ya-ping~2, JIANG Deng-gao~1 (1. Zhengzhou University, Zhengzhou 450052, China; 2. Dept. of Abradant and Abrasion Engineering, Zhengzhou College of Industry, Zhengzhou 450007, China)

【机构】 郑州大学郑州工业高等专科学校郑州大学 郑州450052 郑州工业高等专科学校郑州450007郑州450007郑州450052

【摘要】 研究了Cu CAS CTMAB三元络合物体系,结果表明,其络合物组成为1∶4∶4,λmax=596nm,Δλ=166nm,ε=1.2×105,铜(Ⅱ)的浓度在0.002~1.00μg·ml-1范围内遵守比耳定律,用于超硬材料合成触媒中铜的分析,建立了回归方程,并通过显著性检验,获得了满意的结果。

【Abstract】 It was found that Cu(Ⅱ) forms a ternary complex with CAS and CTMAB with mole ratio of 1∶4∶4. The absorption maxima of this complex lies at the wavelength of 596nm (Δλ=166nm), where it has the apparent molar absorptivity of 1.2×105L·mol-1·cm-1. Beer′s law holds in the range of 0.1~50μg of Cu(Ⅱ) per 50ml of solution. In its application to the analysis of the catalyst samples, RSD′s obtained were less than 4.5%.

【关键词】 光度法三元络合物CASCTMAB触媒
【Key words】 PhotometryTernary complexCopperCASCTMABCatalyst
  • 【文献出处】 理化检验(化学分册) ,Physical Testing and Chemical Analysis Part B Chemical Analysis , 编辑部邮箱 ,2004年08期
  • 【分类号】O657.31
  • 【下载频次】50
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