【摘要】 用α,ω 二氯聚二甲基硅氧烷(DPS)或α 氯聚二甲基硅氧烷(CPS)来改性普通双酚A环氧树脂(BPAER)和四溴双酚A环氧树脂(TBBPAER),目标是制备出一系列可用于电子封装的高韧性高耐热性的环氧基料。通过对固化物的冲击强度、拉伸强度、断裂伸长率和玻璃化转变温度(Tg)以及断裂面形态的测定,探讨了改性方法、有机硅组成与含量等对材料性能的影响。结果表明,当m(BPAER)∶m(DPS)=100∶10时,树脂固化物的冲击强度达到30 5kJ/m2,拉伸强度达46 95MPa,断裂伸长率达到60 23%,Tg达到141 3℃;分别比未改性BPAER提高了19 7kJ/m2,1 69MPa,54 29%以及5 9℃。而当m(TBBPAER)∶m(CPS)=100∶10时,固化物的冲击强度达到17 2kJ/m2,拉伸强度达39 89MPa,断裂伸长率达到5 60%,Tg达到147 0℃;分别比未改性TBBPAER提高了12 8kJ/m2,28 26MPa,4 29%以及7 9℃。更多还原

【Abstract】 Common bisphenol A epoxy resin(BPAER) and tetrabromobisphenol A epoxy resin(TBBPAER) were modified by α,ω-dichloro-polydimethylsiloxane(DPS) or α-chloro-polydimethylsiloxane(CPS) with the aim of producing a series of epoxy-based material with high toughness and thermal resistance suitable for the use of electronic packaging.The influence of modification method and the composition and content of organic silicon on the properties of the cured materials was investigated by mensurating their impact strength,tensile strength,break elongation,glass transition termpereture(T_g) and the morphology of fractured surfaces.The results showed that,when m(BPAER)∶m(DPS)=100∶10,the impact strength of the modified BPAER reached 30.5 kJ/m~2,tensile strength reached 46.95 MPa,break elongation reached 60.23%,and T_g reached 141.3 ℃,which were higher than those of unmodified BPAER by 19.7 kJ/m~2,1.69 MPa,54.29% and 5.9 ℃ respectively.When m(TBBPAER)∶m(CPS)=100∶10,the impact strength reached 17.2 kJ/m~2,tensile strength reached 39.89 MPa,break elongation reached 5.60% and T_g reached 147.0 ℃,which were higher than those of unmodified TBBPAER by 12.8 kJ/m~2,28.26 MPa,4.29% and 7.9 ℃ respectively.更多还原