【摘要】 在半导体的激光微细加工技术里 ,微小曝光区域的温度分布是关键的工艺参数 ,必须得到精确的测量。而为了使温度测量不影响曝光区的温度分布 ,需采用不接触测量方法。研制了计算机温度测量系统 ,实现了微小激光曝光区温度的实时不接触测量。系统中 ,InGaAs/InP光探测器将微小高温区的温度信号转换为光电流 ,再经信号放大及模 /数转换后输入计算机。结合温度定标实验 ,对测得的温度数据进行插值运算 ,在实验中可以实时显示出曝光区的温度值。系统的温度分辨率可达到 0 .2℃ ,测量区域的最小直径可达到 18μm。同时设计了搜索算法 ,使温度数据采集和精密位移平台的移动相配合 ,实现了温度分布的测量和最高温度区的准确定位更多还原

【Abstract】 In laser assisted microprocessing, the temperature distribution in the small exposed region is the main parameter. The temperature distribution should not be influenced by the measurement. Therefore the remote sensing of the temperature distribution in the small exposed region is needed. So a computer-controlled temperature measurement system has been developed. The system can realize the real time temperature measurement of the small laser-exposed region nonintrusively. In the system, a InGaAs/InP photodiode converts the radiation from the small high temperature region into photocurrent. Then the photocurrent is amplified, and converted into digital data. Combining with calibration experiment, the computer calculates the temperature through interpolation. The system can reach a temperature resolution of 0.2℃. The measurement region diameter of 18 μm is also obtained. At the same time, algorithm has been designed to cooperate the move of the motorized stage and the acquisition of temperature data. It follows that the measurement of temperature distribution and the accurate location of the highest temperature region are realized.更多还原