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芯片表面微翅片强化FC-72流动沸腾传热

FC-72 Flowing Boiling Heat Transfer Enhancement on the Chip Surface with Microfin

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【作者】 张正国余昭胜方晓明本田博司

【Author】 Zhang Zheng-guo~1 Yu Zhao-sheng~1 Fang Xiao-ming~1 Hiroshi Honda~2(1.Key Laboratory of Enhanced Heat Transfer and Energy Conservation of the Ministry of Education, SouthChina Univ. of Tech.,Guangzhou 510640,Guangdong,China;2. Institute of Materials Chemistry and Engineering,Kyushu Univ.,Kasuga 816-8580,Fukuoka,Japan)

【机构】 华南理工大学传热强化与过程节能教育部重点实验室九州大学先导物质化学研究所 广东广州510640广东广州510640日本福冈春日816-8580

【摘要】 为采用高效传热技术来提高芯片的冷却效率 ,保证芯片的正常工作 ,研究了不带电介质FC 72在微翅片尺寸 (厚度×翅片高 )分别为 5 0μm× 190μm ,5 0μm× 2 5 0μm ,10 0μm× 15 0μm和 10 0μm× 30 0μm的 4种强化面芯片表面的流动与沸腾传热性能 ,探讨了FC 72过冷度对沸腾传热的影响 ,并与光滑面芯片的沸腾传热性能进行了对比 .实验结果表明 ,随着FC 72过冷度的增大 ,所有实验芯片的临界热流密度增大 .强化面芯片的临界热流密度所对应的壁温低于 85℃ ,而光滑面芯片的临界热流密度所对应的壁温高于85℃ .在相同过冷度下 ,强化面芯片的最大热流密度是光滑面芯片的 7~ 9倍 ,表明微翅片结构能显著地强化不带电介质FC 72的沸腾传热

【Abstract】 To improve the cooling efficiency of the chip by using the high-efficiency heat transfer technology and ensure the normal operation of the chip, the flow and boiling heat transfer characteristics of four kinds of chips with the microfin surfaces immersed in saturated FC-72 were investigated, with the microfin dimensions (thickness×height) of 50 μm ×190μm, 50 μm×250 μm, 100 μm×150 μm and 100 μm×300 μm, respectively. The effect of FC-72 subcooling on the boiling heat transfer was also investigated, with the results compared to those of a chip with smooth surface. The experimental results show that, with the increasing of FC-72 subcooling, the critical heat flux (CHF) increases for all the tested chips. For chips with microfin surfaces, the wall temperature corresponding to the CHF is less than (85 ℃), while for those with smooth surfaces, it is more than (85 ℃). It is also shown that, with the same FC-72 subcooling, the maximum allowable heat flux for chips with microfin surfaces are 7~9 times that of those with smooth surfaces, which proves that the microfin can obviously enhance the boiling heat transfer of FC-72.

【关键词】 芯片微翅片强化FC-72沸腾传热
【Key words】 chipmicrofinenhancementFC-72boiling heat transfer
  • 【文献出处】 华南理工大学学报(自然科学版) ,Journal of South China University of Technology(Natural Science) , 编辑部邮箱 ,2004年10期
  • 【分类号】TN405
  • 【被引频次】6
  • 【下载频次】282
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