【摘要】 为采用高效传热技术来提高芯片的冷却效率 ,保证芯片的正常工作 ,研究了不带电介质FC 72在微翅片尺寸 (厚度×翅片高 )分别为 5 0μm× 190μm ,5 0μm× 2 5 0μm ,10 0μm× 15 0μm和 10 0μm× 30 0μm的 4种强化面芯片表面的流动与沸腾传热性能 ,探讨了FC 72过冷度对沸腾传热的影响 ,并与光滑面芯片的沸腾传热性能进行了对比 .实验结果表明 ,随着FC 72过冷度的增大 ,所有实验芯片的临界热流密度增大 .强化面芯片的临界热流密度所对应的壁温低于 85℃ ,而光滑面芯片的临界热流密度所对应的壁温高于85℃ .在相同过冷度下 ,强化面芯片的最大热流密度是光滑面芯片的 7～ 9倍 ,表明微翅片结构能显著地强化不带电介质FC 72的沸腾传热更多还原

【Abstract】 To improve the cooling efficiency of the chip by using the high-efficiency heat transfer technology and ensure the normal operation of the chip, the flow and boiling heat transfer characteristics of four kinds of chips with the microfin surfaces immersed in saturated FC-72 were investigated, with the microfin dimensions (thickness×height) of 50 μm ×190μm, 50 μm×250 μm, 100 μm×150 μm and 100 μm×300 μm, respectively. The effect of FC-72 subcooling on the boiling heat transfer was also investigated, with the results compared to those of a chip with smooth surface. The experimental results show that, with the increasing of FC-72 subcooling, the critical heat flux (CHF) increases for all the tested chips. For chips with microfin surfaces, the wall temperature corresponding to the CHF is less than (85 ℃), while for those with smooth surfaces, it is more than (85 ℃). It is also shown that, with the same FC-72 subcooling, the maximum allowable heat flux for chips with microfin surfaces are 7～9 times that of those with smooth surfaces, which proves that the microfin can obviously enhance the boiling heat transfer of FC-72.更多还原