【摘要】 以铜基合金粉末为焊材 ,对ZCuBe2 .5合金进行了液膜溶解扩散连接。用铜基合金粉材所获得的焊缝组织由均匀细小的α -Cu等轴晶和晶间金属间化合物组成。界面母材仍保持其原始粗大的α -Cu树枝晶和晶间γ包晶相组织形貌。焊缝与母材结合良好 ,通过原子互扩散形成了厚度约 1 30～ 1 6 0 μm的过渡固溶体结合界面。随着粉末粒度的减小 ,焊缝中等轴晶尺寸逐渐减小 ,焊缝组织得到明显的细化 ;形成的扩散过渡层厚度减小 ,组织更加致密 ,接头抗拉强度增大 ;热影响区变窄 ,硬度分布更趋合理。扩散连接过程中温度梯度的存在可使液膜溶解扩散焊在很短的时间内实现高强度连接更多还原

【Abstract】 The liquid film solution diffusion welding of ZCuBe2.5alloy were conducted using Cu-based alloy powder as welding materials.It is found that the microstructure consists of homogenous, fine ct-Cu e-quiaxed grains and intercrystal metallic compounds, and the base metalnear the interface still remains the original morphology of coarse ct-Cudendrites and intercrystal ~, peritectic phases. The filler metal joins basemetal perfectly, and the transition solution layers with 130-160trm thick-ness form due to mutual diffusion of interface atoms. As the increase ofmesh size, the sizes of equiaxed grains decrease gradually ; the weld mi-crestructure becomes more fine ; the thicknesses of diffusion transition lay-er decrease; the interface microstructure becomes fine and close; the jointtensile strength increase; the heat-affected zone become narrow; and thehardness distribution tends to be more reasonable. Due to the existence ofthe temperature gradient, the liquid film solution diffusion bending canrealize the high strength bonding in a short time.更多还原