【摘要】 本文论述了细线PCB组装引起的特别挑战和电子封装测试技术方面的改进 ,简要说明了一些测试方法诸如在线测试 (ICT)、自动X射线测试 (AXI)和扫描声学显微镜检测 (SAM ) ,最后表明了现代封装技术 (FC、CSP)及其与之并驾齐驱的封装测试技术的发展前景。更多还原

【Abstract】 Special challenge and packaging test solutions caused by fine line PCB assembly is presented in this article. Some test techniques such as in-circuit test, automated X-ray inspection, and scanning acousic microscopy are briefly stated. Finally, the results show the future of FC and CSP and its test solutions which are evolving to keep pace with the new packaging technology.更多还原