【摘要】 对双悬臂梁高量程MEMS加速度传感器的封装结构进行了1×105g峰值的半正弦加速度冲击载荷下的有限元响应分析。灌封胶弹性模量的变化对加速度计的输出信号(输出电压、悬臂梁的挠度)的影响可以忽略。输出电压曲线的峰值与解析解接近。加速度计的悬臂梁表现为有阻尼下的受迫振动,并表现出悬臂梁的固有频率特性。输出信号的峰值与加速度载荷的峰值均呈很好的线性关系。灌封胶的弹性模量大于4GPa时胶已经足够硬,适宜用于保护芯片。更多还原

【Abstract】 The dynamic response of the package structure for a high -g MEMS accelerometer with double cantilever beams under high -g shock acceleration was simulated using finite element method.By applying half sine pulse of accele ration with 100,000g’ s peak,it is found that the effect of modulus of encapsulant on the simula ted output voltage and beam deflection can be ignored.The peak value of output voltage is close to th e analytic solution.The cantilever beams of accelerometer behave as forced vibration,with the cantilever beams ’ natural characteristic frequency u nder damping.But the peak values of output voltage and beam deflection show good linearity with peak acceleration applied.Encapsulant with elastic modulus above 4GPa is rigid enough to e ncapsulate the chip.更多还原