节点文献
电子封装SiCp/356Al复合材料制备及热膨胀性能
Preparation of SiC particulate reinforced 356Al matrix composite for electronic packaging and its thermal expansion performance
【摘要】 采用无压渗透法制备了SiCp/356Al复合材料,用SEM和XRD对复合材料组织形貌和物相进行了研究,测定了复合材料在50~400℃温度区间的热膨胀系数,分析了复合材料热膨胀性能的影响因素。结果表明SiCp/356Al复合材料中SiC颗粒分布均匀,无明显新相形成,复合材料的热膨胀系数比基体合金的热膨胀系数显著降低,复合材料热应力引起热膨胀性能的变化随温度的不同而不同。
【Abstract】 SiCp/356Al composite was prepared by pressureless infiltration. The microstructure and phases of SiCp/356Al composite was investigated by means of scanning electron microscope(SEM) and X-ray diffraction(XRD). The coefficient of thermal expansion (CTE) of SiCp/356Al composite was measured in the temperature interval of 50~400℃.The influence factors on thermal expansion performance were analyzed. The results show that the distribution of particulates in SiCp/356Al composite is homogeneous. No new phase appears in the composite. The CTE of the composite decreases apparently by comparison with the CTE of its matrix alloy. The influence of thermal stress on the CTE of the composite depends on temperature range.
【Key words】 electronic packaging; pressureless infiltration; SiCp/356Al composite; coefficient of thermal expansion;
- 【文献出处】 功能材料 ,Journal of Functional Materials , 编辑部邮箱 ,2004年04期
- 【分类号】TB331;TN604
- 【被引频次】37
- 【下载频次】362