【摘要】 在当今快速朝着大规模、小体积、高速度的方向发展的电子设计领域中,体积减小导致电路的布局布线密度变大,同时信号的频率还在提高,使得串扰成为高速、高密度PCB设计中值得关注的问题,就串扰的机理,分析了影响串扰的因素,并提出相应的控制方法更多还原

【Abstract】 With the quick development of large-scale, small-size and high-speed electronics circuits design, the circuitry density is increasing due to the decrease of the layout size of PCB. Furthermore, the signal frequencies are increasing. Therefore the cross-talk has become one of the most important issues in the high-speed adn high-density PCB design. Based on the analysis of mechanism of cross-talk, the main factors affecting the cross-talk in the high-speed PCB design are studied, and corresponding eliminating methods have been proposed.更多还原