【摘要】 利用电化学测试技术,在实验室条件下研究了硫酸盐还原菌(SRB)对铜镍合金腐蚀行为的影响。实验结果表明,SRB的存在使电极开路电位明显负移,极化电阻在细菌生长后期迅速降低。在含SRB的溶液中,铜镍合金表面会形成由腐蚀产物和SRB等组成的混合膜,腐蚀速度受到Cu+通过混合膜向电极表面扩散速度的控制。更多还原

【Abstract】 Effects of SRB (sulfate-reducing bacteria) on corrosion of Cu-Ni alloy was studied using electrochemical techniques under laboratory conditions. Products of metabolism of SRB led to potential shift from -280mV to -700mV(vs.SCE) and decrease of polarization resistance about two decades. The corrosion rate was determined by the diffusion of Cu~+ to the electrode surface.更多还原