【摘要】 在无铅条件下提高PCBA可制造性涉及的因素包括 :PCB和元器件的制造、焊料 (焊膏 )的选用、设备的加工能力以及工艺技术等。本文通过分析PCBA可制造性的内涵 ,提出装联无铅化的关键所在 ,重点论述了在采用Sn -Ag -Cu和Sn -Cu钎料的条件下 ,实现无铅再流焊和无铅波峰焊的技术途径和对策更多还原

【Abstract】 Improving producibility of PCBA includes much factors, such as fabrication of PCB ,design of component, selection of solder, capability of equipment and technology of process. Analyse the producibility principle of PCBA, and critical techniques of lead free is proposed and researched. Finally, the research on the key impacts of Sn-Ag-Cu and Sn-Cu lead free solder and their implementation in lead free reflow soldering and lead free wave soldering is presented.更多还原