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氧气氛退火对BST薄膜电阻热敏特性的影响

BST Thin-film Resistor: Effect of Annealing Under Oxygen on Thermosensitive Characteristics

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【作者】 刘玉荣李观启罗坚李斌黄美浅

【Author】 LIUYu-rong, LI Guan-qi, LUO jian, LI Bin, HUANG Mei-qian (Department of Applied Physics, South China University of Technology, Guangzhou 510640, China)

【机构】 华南理工大学应用物理系华南理工大学应用物理系 广东广州510640广东广州510640广东广州510640

【摘要】 利用氩离子束镀膜技术在 SiO2/Si 衬底上淀积 BST 薄膜,研究了氧气氛下退火对 BST 薄膜热敏特性的影响。结果表明,当退火温度不太高时(≤600℃),薄膜热敏特性随退火温度升高而变差;但当退火温度较高时(>600℃),薄膜热敏特性随退火温度升高而得到改善。在室温至 200℃范围内 BST 薄膜具有较好的热敏特性,其温度系数最大值为–5.3 %℃–1。并利用 SEM 和 AES 分析了退火条件对薄膜电阻热敏特性的影响机理。

【Abstract】 Ba1- SrxTiO3 thin film was deposited on a SiO2/Si substrate by the argon ion-beam sputtering. The effects of x annealing under O2 on thermosensitive characteristics of the thin film were studied, and the results show that when the annealing temperature is not too high (≤600℃), the higher the annealing temperature, the lower is the thermosensitive. when the annealing temperature is high (>600℃), the higher the annealing temperature, the higher is the thermosensitive. From room temperature to 200℃, the thin film has good thermosensitive characteristic with a maximum temperature coefficient of –5.3% ℃–1. Moreover, the effects of annealing condition on thermosensitive properties of the thin film resistor are analyzed using SEM and AES measurement.

  • 【文献出处】 电子元件与材料 ,Electronic Components $ Materials , 编辑部邮箱 ,2004年12期
  • 【分类号】O484.4
  • 【下载频次】99
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