【摘要】 塑料封装器件暴露在一定的潮湿环境下将会吸收潮湿的现象已经得到广泛的认同。针对实际的PBGA器件,采用通用有限元软件分析和计算了器件在潮湿环境下的潮湿扩散。并且计算了由于吸潮使器件在高温下产生的湿热应力。有限元模拟计算表明,不同潮湿环境下器件的潮湿扩散状态是不一样的,这导致在其后的高温焊接过程中器件内部产生的湿热应力的不同。更多还原

【Abstract】 Plastic electronic packages are known to absorb moisture when exposed to humid ambient condition. A specified PBGA package is used as a demonstrator. The finite element analysis on moisture diffusion in microelectronic plastic packages during moisture preconditioning by using a commercial FEA software is studied and modeled. Then, the hygrothermal stress in the electronic packages which be induced under high-temperature are calculated. The finite element result shows that the hygrothermal stress induced during solder reflow depends on the moisture state in the package, which vary with different moisture preconditioning.更多还原