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脉冲复合电镀（Ni-P）-纳米微粒SiO₂工艺

A Study of the Technology of （Ni-P）-nanometer SiO₂ Composite Pulse Electroplating

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【Author】 CAO Tie-hua~1, CHENG Dan-hong~1, SANG Fu-ming~2, YUAN Rong~1, XU Wei-yi~1 (1. Inst. of Environment and Chemistry, Shanghai Univ., Shanghai200072, China; 2. Dept. of Chem. Dept., Sciences School, Shanghai Univ., Shanghai200436, China)

【机构】上海大学环境与化学工程学院；上海大学理学院；上海大学环境与化学工程学院上海　200072；上海　200072；上海　200436；上海　200072；

【摘要】采用脉冲电流,制备(Ni-P)-纳米SiO2复合镀层。通过正交试验设计的方法,重点考察了脉冲平均电流密度、脉宽、占空比、搅拌方式及纳米SiO2的添加量对镀层沉积速率、镀层硬度以及镀层中SiO2质量分数的影响,从而遴选出最佳的电镀工艺。同时,对脉冲电镀与直流电镀进行了比较。更多还原

【Abstract】 By the method of pulse electroplating, （Ni-P）-nanometer SiO₂ composite coating was prepared. The effects of process conditions such as average current density, pulse width, duty-cycle, stirring style and quantity of nanometer SiO₂ on deposition rate, hardness and quantity of SiO₂ in coating were studied through orthogonal experiments and the technology of electroplating was optimized. Meantime the pulse plating was compared with the direct current process.更多还原