节点文献
Surface Electromechanical Coupling on DLC Film with Conductive Atomic Force Microscope
【摘要】 <正> Diamond-like carbon (DLC) film composed of microscopically insulation but microscopically a mixture of conducting (sp2) and insulating (sp3) phases was discussed on the local modification with a conductive atomic force microscope (C-APM). Especially, a topographic change was observed when a direct current (DC) bias-voltage was applied to the DLC film. Experimental results show that a nanoscale pit on DLC surface was formed when applying a positive 25 V on DLC film. According to the interacting force between CoCr-coated microelectronic scanning probe (MESP) tip and DLC surface, as well as the Sondheimer oscillation theory, the "scalewing effect" of the pit was explained. Electromechanical coupling on DLC film suggested that the depth of pits increased with an increase of load applied to surface when the cantilever-deflected signal was less than a certain threshold voltage.
【Abstract】 Diamond-like carbon (DLC) film composed of microscopically insulation but microscopically a mixture of conducting (sp2) and insulating (sp3) phases was discussed on the local modification with a conductive atomic force microscope (C-APM). Especially, a topographic change was observed when a direct current (DC) bias-voltage was applied to the DLC film. Experimental results show that a nanoscale pit on DLC surface was formed when applying a positive 25 V on DLC film. According to the interacting force between CoCr-coated microelectronic scanning probe (MESP) tip and DLC surface, as well as the Sondheimer oscillation theory, the "scalewing effect" of the pit was explained. Electromechanical coupling on DLC film suggested that the depth of pits increased with an increase of load applied to surface when the cantilever-deflected signal was less than a certain threshold voltage.
【Key words】 atomic force microscope; diamond-like carbon; surface modification; electromechanical coupling;
- 【文献出处】 Plasma Science & Technology ,等离子体科学和技术(英文版) , 编辑部邮箱 ,2004年03期
- 【分类号】O484
- 【被引频次】2
- 【下载频次】41