【摘要】 针对大功率DC/DC模块电源高功率密度、高效率、高可靠性的发展趋势,对模块电源的封装结构进行了探讨。发展了一种新型的三维叠层封装结构,采用该结构在实验室完成了一台样机。应用铝基板、表面贴装器件(SMT)、平面变压器和尖峰抑制器等多种最新技术,设计出兼顾模块电气性能的工艺结构。论文给出了样机的装配过程,并对实验结果进行了简单的分析。更多还原

【Abstract】 Aiming at the developing trends of high power DC/DC module power supply,the paper analyzes the issues about package structure and develops a new three-dimensional stacked-layer package structure.A prototype converter is set up in the lab,at the same time,many new technologies,such as Al substrate,Surface Mounting Technology(SMT),planar transformer and noise suppressors are applied.The assembly processes and the experimental results are included in this paper.更多还原