【摘要】 硅片超精密磨床是半导体集成电路(IC)制造中的关键装备,主要应用于IC制程中的硅片制备加工和IC后道制程中图形硅片的背面减薄。国外硅片超精密磨床制造技术发展很快,具有高精度化、集成化、自动化等特点。介绍了超精密磨床在大尺寸(≥φ300mm)硅片超精密加工中的应用状况,详细评述了国外先进硅片超精密磨床的特点,并指出了大尺寸硅片超精密加工技术的发展趋势。更多还原

【Abstract】 Ultra-precision grinding machine is one of the key equipments in integrated circuit manufacturing, which is mainly used in both manufacture of primary wafer and backside thinning of patterned wafer. The advanced ultra-precision grinding machines have been developed and have features of high precision, integratization and automatization etc. In this paper, the present status of the ultra-precision grinding machines applied in large scale wafer (≥φ300mm) are introduced, their features are analyzed in detail, and the development trends of ultra-precision machining technology for large scale wafer are predicted.更多还原