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铜锡合金电镀液中铜、锡含量的测定

Continuous determination of copper and tin content in Cu-Sn alloy electroplating bath

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【作者】 秦淑琪何英

【Author】 QIN Shu-qi~1, HE Ying~2(1. School of Chemistry and Chemical Engineering, Northwest Normal University, Lanzhou 730070, China; 2. Department of Chemistry, Lanzhou Teachers College, Lanzhou 730070, China)

【机构】 西北师范大学化学化工学院兰州师范高等专科学校化学系 甘肃兰州 730070甘肃兰州 730070

【摘要】 提出采用交流示波极谱法连续测定铜锡合金电镀液中铜锡的含量。该方法不用指示剂,利用铅标准溶液及EDTA标准溶液,借助交流示波极谱仪中示波图上TPB切口的出现检测终点。通过实验确定酸度为5 8、掩蔽剂为硫脲。对该方法与指示剂法分析结果进行了比较。结果表明,该方法的精密度更高,准确度更好,是一种快速、简便、经济实用且无污染的测定镀铜锡合金电镀液中铜锡含量的新方法。

【Abstract】 Alternating oscillopolarography was promoted to continuously detect the copper and tin content in Cu-Sn alloy electroplating bath with the appearance of the TPB cut in oscillogram as end point. In the method, lead standard solution and EDTA standard solution were used without indicator. The suitable pH value and masking agent were determined to be 5.8 and sulfourea respectively by experiment. The analysis results of the method were compared with those of indicator method. The results show that the method has better precision and accuracy, and is fast, convenient, economical, useful and contamination-free. It is proved to be a new method of detecting the copper and tin content in Cu-Sn alloy electroplating bath.

【基金】 甘肃省教委科研基金资助项目(995-22)。
  • 【文献出处】 电镀与涂饰 ,Electroplating & Finishing , 编辑部邮箱 ,2004年06期
  • 【分类号】TQ153
  • 【被引频次】4
  • 【下载频次】378
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