【摘要】 双槽电沉积制备单层膜厚1μm的Ni Mo P/Cu多层膜。采用XRD、SEM等方法研究了多层膜的热稳定性及其表面和截面形貌。结果显示,Ni Mo P/Cu多层膜与Ni P/Cu多层膜相比,具有较高的晶化温度、更高的热稳定性。更多还原

【Abstract】 Ni-Mo-P/Cu multilayers were electrodeposited using dual bath in which each layer had the thickness of (1 μm.) Thermostability, morphology of surface and cross section were studied with X-Ray Diffraction (XRD) and Scanning Electron Microscopy (SEM). Results show that Ni-Mo-P/Cu multilayers have higher crystallization temperature, therefore have better thermostability than Ni-P/Cu multilayers.更多还原