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玻璃微球表面化学镀银

Electroless silver plating for glass microsphere

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【作者】 黄少强邱文革

【Author】 HUANG Shao-qiang, QIU Wen-ge (College of Environment and Energy Engineering, Beijing University of Technology, Beijing 100022, China)

【机构】 北京工业大学环境与能源工程学院北京工业大学环境与能源工程学院 北京 100022北京 100022

【摘要】 研究了玻璃微球表面镀银过程中还原剂对镀层结合紧密程度、产品导电性的影响,并对银镀层的性能进行了测试。结果表明,用葡萄糖和酒石酸钾钠混合作还原剂改进了镀层的均匀度和结合强度。镀银玻璃微球有望用作高导电性聚合材料的导电填料。

【Abstract】 Effects of different reducing agents on the compactibility of plating layer and conductivity of products were discussed in electroless Ag plating for glass microsphere. The properties of Ag deposit were also determined. The results show that both the uniformity and adhesion of Ag deposit were improved using compound of glucose and potassium tartrate as reducing agent. Ag electroless deposited glass microsphere can be possibly used as conductive filler of high conductive polymer materials.

【基金】 北京市自然科学基金资助项目(2032002)
  • 【文献出处】 电镀与涂饰 ,Electroplating & Finishing , 编辑部邮箱 ,2004年01期
  • 【分类号】TQ153
  • 【被引频次】53
  • 【下载频次】740
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