【摘要】 综合比较了现有电子封装材料的性能及其在航空航天领域中的应用现状,较详细地阐述了高硅铝合金电子封装材料的性能特点、制备方法及研究现状,指出了高硅铝合金轻质电子封装材料的发展方向。更多还原

【Abstract】 This paper summarizes some characteristics of convention electronics packaging materials and itsapplication in aviation and spaceflight fields.It particularly gives a detailed description of high silicon aluminium alloyelectronic packaging material in terms of its characteristic,preparation methods and status of research,and predicatesdirection of developing this packing material high silicon aluminium alloy.更多还原