【摘要】 概述了关于无铅电子焊料全球范围的立法与研发计划、国内外无铅焊料的发展现状及所取得的研究成果,探讨了无铅焊料合金的专利问题,进行了无铅软钎焊技术可行性、经济性和可靠性分析,介绍了无铅焊料的应用情况,并展望了前景。更多还原

【Abstract】 The global legal regulations on leaded solder and research and development programs on lead-freesolder around the world are briefly introduced.The progress and main achievements of lead-free solder are re-viewed.The patent problem on lead-free solder materials,the feasibility,economic aspect,and reliability of lead-freesoldering technology are analysed.The current status and future prospects of application of lead-free soldering are pre-sented.更多还原