【摘要】 表面镀银的非金属粉体材料可作为导电填料用于多种领域,为探索不同助剂和pH值对镀层质量的影响及原因,以玻璃微球为材料,用几种不同高分子化合物(PEG,CMC和明胶等)做助剂,在不同的pH值(7.5,9.5,11.5和13.5)条件下进行反应,得到了镀层质量随反应时间的变化曲线(镀速曲线),并对镀银产品进行SEM分析。结果表明,PEG和乙醇均使镀层质量有所提高,其中PEG作用最明显,而CMC和明胶的加入则起反作用;镀银液pH值为13.5左右反应可得质量较好的镀层,并从机理方面对此进行了阐释;混合助剂在pH=13.5时以PEG和EtOH组合作助剂可得高质量的镀层。更多还原

【Abstract】 Agcoated nonmetallic powder materials can be used as conductive fillings mmany industrial fields.The effect factors such as additives PEG.CMC and gelatin and pH values were studied in the process of eleetroless silver plating on glass microspheres.The plating rate curves and SEM morphologies of Ag coating were analyzed and discussed.Results show that both PEG and EtOH can improve the quality of the Ag coating and PEG is in particular, but CMC and gelatin are counteractive. The better pH value is 13.5.Effect mechanisms are presented.Ag coating with higher quality can be obtained by using PEG and EtOH as compound additive and pH = 13.5.更多还原