【摘要】 结合典型的MEMS器件真空封装工艺,应用真空物理的相关理论,建立了MEMS器件真空封装的数学物理模型,确定了其数值模拟算法。据此,对一封装示例进行了计算,获得了真空回流炉内干燥箱及密封腔体真空度的变化情况,实现了MEMS器件真空封装工艺过程的参数化建模与模拟。更多还原

【Abstract】 Mathematical and physical model of MEMS packaging is established and its arithmetic is ascertained by applying the vacuum physics to typical vacuum packaging process.The vacuum degree in an oven and cavity is obtained,and parametrical modelling and simulation of vacuum packaging of MEMS devices are realized.更多还原