【摘要】 适应自动化仪表智能化和小型化的趋势,温度变送模块采用电源、输入和输出三者隔离的结构及小型化设计,采用了高准确度A/D、新型MCU、数字校准及现场总线等技术,具有高准确度和低功耗特点。它适用于所有常见的热电阻和热电偶,具有1～5V和4～20mA输出,整体准确度达到了0.1%,同时,还支持基于RS485接口的MODBUS现场总线协议。更多还原

【Abstract】 Being met the trends of automatic instrument intellecuality and miniaturizations, temperature transmitted module adopts miniaturization design and the structure which separates power supply, input and output. The module adopts many technologies, such as high accuracy A/D, new-type MCU,figure regulation and site-bus,etc.There is much characteristic about the module,such as high accuracy and low power consumption.It can be met all common thermal resistance and electric thermocouple, its output is 1～5 V and 4～20 mA industry standard signal.The whole accuracy of the module has reached 0. 1 %.At the mean time,the kind of module still supports MODBUS site-bus protocol based on RS485 interface.更多还原