【摘要】 采用有限元分析方法对 vf- BGA焊球的热疲劳特性进行了模拟 .通过扫描电镜 (SEM)对温度循环试验后焊球金属间化合物 (IMC)层和剪切强度试验后的断裂面进行了形貌、结构和组分的观察及分析 .实验和模拟结果表明 :热疲劳负载下焊球的剪切疲劳强度 ,受到焊球塑性应变能量的积累和分布以及金属间化合物层的厚度和微结构变化导致的界面脆性等因素的影响 .使用 Darveaux能量疲劳模型的裂纹初始化寿命预测结果与实验数据一致更多还原

【Abstract】 Software ANSYS with finite element analysis(FEA) method is employed to simulate thermal fatigue behavior of solder joints.The compose and microstructure of intermetallic compound after temperature cycling test are also observed by scanning electron microscope(SEM).The results of experiment and simulation indicate that the shear and fatigue strength of solder joints are affected by the stress strain accumulation,intermetallic compound (IMC) thickness,and microstructure of IMC.The predicted crack initial lifetime with Darveaux energy model is verified by the experimental data.更多还原