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激光在MEMS键合技术中的应用
Laser Applications in Bonding of MEMS
【摘要】 键合技术已经广泛地应用于微电子机械系统(MEMS)领域,但传统的键合技术由于其缺点,限制了其应用范围,而激光以其独特的优势在键合技术中得到了人们的重视。文章介绍了激光在键合技术中的应用及其原理,以及今后发展的方向。
【Abstract】 The bonding technology is widely used in the fields of MEMS, and its applicationis limited due to some disadvantages in traditional bonding method of MEMS. Laser uniqueperformances are received great attention in bonding technology. Laser application, principle andfuture developmental direction in bonding of MEMS are presented.
【基金】 北京市教委资助项目(KM200310005009).
- 【文献出处】 半导体光电 ,Semiconductor Optoelectronics , 编辑部邮箱 ,2004年02期
- 【分类号】TN405
- 【被引频次】4
- 【下载频次】299