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表面应力引起的弹性薄膜形状分叉

Shape Bifurcation of an Elastic Wafer Due to Surface Stress

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【作者】 闫琨何陵辉刘人怀

【Author】 YAN Kun1,HE Ling_hui1,LIU Ren_huai2 University of Science and Technology of China, Hefei 230027, P.R.China;2. Institute of Applied Mechanics, Jinan University, Guangzhou 510632, P.R.China)

【机构】 中国科学技术大学材料力学行为和设计重点实验室暨南大学应用力学研究所 合肥230027合肥230027广州510632

【摘要】 此工作致力于无约束各向同性弹性薄膜在表面应力发生变化时几何非线性变形分析· 基于能量的考虑,导出了曲率与表面应力变化量的关系· 与已有线弹性分析结果的显著区别是,当薄膜很薄而上下表面应力差足够大时,薄膜曲率的解不再唯一,而会发生分叉·

【Abstract】 A geometrically nonlinear analysis was proposed for the deformation of a free standing elastically isotropic wafer caused by the surface stress change on one surface. The link between the curvature and the change in surface stress was obtained analytically from energetic consideration. In contrast to the existing linear analysis, a remarkable consequence is that, when the wafer is very thin or the surface stress difference between the two major surfaces is large enough, the shape of the wafer will bifurcate.

  • 【文献出处】 应用数学和力学 ,Applied Mathematics and Mechanics , 编辑部邮箱 ,2003年10期
  • 【分类号】O343
  • 【被引频次】12
  • 【下载频次】194
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