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玻璃表面的无钯活化化学镀镍

Electroless Nickel Plating on Glass Substrate by Palladium-Free Activation

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【作者】 王森林吴辉煌

【Author】 WANG Sen Lin * (College of Materials Science and Engineering,Huaqiao University,Quanzhou 362011) WU Hui Huang (State Key Laboratory for Physical Chemistry of Solid Surface,Department of Chemistry,Xiamen University,Xiamen 361005)

【机构】 华侨大学材料科学与工程学院厦门大学化学系固体表面物理化学国家重点实验室 泉州362011厦门

【Abstract】 A new process of electroless plating of nickel on glass substrate without using conventional palladium choride solution activator has been developed. The activation solution consists of nickel acetate, citric acid, and methanol. Heat treatment process of activation solution has been monitored by DTA TGA and XRD. The results show that the activation solution was completely decomposed into hexagonal Ni and cubic NiO at 310 ℃. The amorphous electroless deposits was determined by XRD and it contains Ni 88 4% and P 11 6%(mass fraction) by chemical analysis.

【基金】 国家自然科学基金资助课题 ( 2 0 0 73 0 3 5 )
  • 【文献出处】 应用化学 ,Chinese Journal of Applied Chemistry , 编辑部邮箱 ,2003年05期
  • 【分类号】TQ153.3
  • 【被引频次】33
  • 【下载频次】421
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