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铅掺杂对锡电沉积物形貌的影响
Influence of Doped Pb on the Morphology of Sn Electrodeposition
【摘要】 采用电化学沉积 ,配合扫描电镜 (SEM)、电子探针微分析仪 (EPMA)、金相等分析技术 ,研究了纯Sn及Pb0 .1Sn0 .9的二维沉积物的显微形貌和微结构 .结果表明 :由于晶粒生长的择优取向 ,纯锡的沉积物是规则的枝晶结构 ;铅掺杂削弱了锡晶粒生长的择优取向性 ,导致枝晶主干分叉 ,形成“之”字形枝晶结构 .为结晶学因素对生长形貌的影响提供了一个实验证据 .
【Abstract】 Using the electrodeposition and analytic technologies of SEM and EPMA, as well as metallography, the microscopic morphology and microstructure of 2D deposits of Sn and Pb 0.1Sn 0.9 are investigated. The results show that the deposit of Sn is regular dendrite because of preferred orientation of growth; when little Pb is added, the Pb crystallite grains distributing dispersively in the deposit weaken the preferred orientation of growth, which leads to the tip-split of dendrite back-bone, and results in the formation of dendrite with zigzag branches.
- 【文献出处】 武汉大学学报(理学版) ,Wuhan University Journal(Natural Science Edition) , 编辑部邮箱 ,2003年03期
- 【分类号】O781
- 【被引频次】2
- 【下载频次】103