【摘要】 键合互连是实现微波多芯片组件电气互连的关键技术 ,键合互连的拱高、跨距和金丝根数对其微波特性具有很大的影响。本文采用商用三维电磁场软件HFSS和微波电路设计软件ADS对低温共烧陶瓷微波多芯片组件中键合互连的微波特性进行建模分析和仿真优化。仿真优化结果与LTCC试验样品的测试结果吻合较好更多还原

【Abstract】 Bonding interconnect is the critical technique for realizing the interconnect of microwave multichip module(MCM). The height, distance and number of wires of bonding interconnect have important effects on its microwave characteristics. In this paper, commercial 3D electromagnetic analysis software HFSS and microwave circuit design software ADS were used to model, simulate and optimize for the microwave characteristics of bonding interconnect in low temperature co-fired ceramics(LTCC) microwave MCM. The simulations were shown to be in good agreement with the experimental results.更多还原