【摘要】 化学机械抛光(chemicalmechanicalpolishing,简称CMP)技术几乎是迄今惟一的可以提供全局平面化的表面精加工技术,可广泛用于集成电路芯片、计算机硬磁盘、微型机械系统(MEMS)、光学玻璃等表面的平整化.该文综述了CMP技术的研究现状,指出了CMP急待解决的技术和理论问题,并对其发展方向进行了展望.更多还原

【Abstract】 Chemical mechanical polishing (CMP) is the only finish machining technique up to date for surface global planarization, which has been widely used for the manufacturing of integrated circuits (IC), hard disk, micro-electromechanical systems (MEMS), optical glass,etc. The progress and problems of CMP are reviewed in the paper, and the future prospect of CMP is outlined.更多还原