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桐马环氧胶粘剂的改性研究
Improvement of Tong-Ma epoxy adhesive for mica tape
【摘要】 为缩短桐马环氧胶粘剂的固化温度和时间,对粉云母带用桐马环氧胶粘剂配方进行研究,探索了新型固化促进剂对胶粘剂固化速度及温度的影响。用该促进剂配制的环氧胶粘剂具有凝胶时间短、介质损耗小、固化温度低绝缘性能好等特点,明显降低了能耗。
【Abstract】 A new curative accelerant of TongMa epoxy adhesive for a richresin mica tapes are studied.The curative temperaturei is decreased from 170℃ to 150℃,but the curative time does not overtime compared with a original curative accelarant.Particularly,the epoxy adhesive with the composite of the new accelerant and the original accelerant have much better dielectricity and storage stability than those of one of the both accelerants.
- 【文献出处】 绝缘材料 ,Insulating Materials , 编辑部邮箱 ,2003年05期
- 【分类号】TQ433
- 【被引频次】1
- 【下载频次】66