【摘要】 利用双层辉光离子渗金属技术在纯铜表面制备了铜钛合金层。实验结果表明 ,合金层由以铜钛化合物为主的表层和钛在铜中α固溶体与弥散分布的Cu4 Ti有序相的次表层组成。在源极与工件间距固定的条件下 ,表层成分受源极电压、工件电压和温度的影响 ,次表层厚度主要受温度和时间影响。在扩渗初期 ,轰击离子的强度对钛元素有催渗作用。源极电压与工件电压之比V源 V工 ≥ 2 ,气压选在(2 5～ 4 0 )Pa有利于铜钛合金层的形成。纯铜渗钛虽可使材料表面强化 ,但表面电阻明显增大更多还原

【Abstract】 Titanizing on the surface of pure copper was conducted with double glow discharge process. The experimental results showed that the alloying layer consists of surface layer, which is composed of Cu-Ti compounds and subsurface layer, which is made up of α solid solution and Cu\-4Ti. Under the condition of fixed distance between Ti resource cathode and specimen, the composition of surface layer is affected by Ti resource cathode voltage,specimen voltage and temperature. The thickness of subsurface layer is increased with the time extending at the working temperature . The ratio of Ti resource cathode voltage and specimen voltage, V r/ V s≥2 and Ar pressure: P =25-40Pa are beneficial to the forming of Cu-Ti alloying layer. Titanizing can strengthen the surface of pure copper, but its surface electrical resistance is obviously increased.更多还原