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CVD金刚石薄膜的微机械加工技术研究进展
PROGRESS OF THE RESEARCH ON THE MICRO-MECHANICAL MACHINING TECHNIQUE FOR CVD DIAMOND FILM
【摘要】 金刚石薄膜是一种蕴涵巨大应用潜力的新型电子功能材料,但是它极高的硬度和化学稳定性使其难以被加工成型,因此,金刚石薄膜的微机械加工技术是其MEMS应用的关键技术问题之一。本文介绍了近年来国内外在选择性生长、模型复制、激光刻蚀和等离子体刻蚀等金刚石微机械加工技术方面的研究进展,着重探讨了可以直接对金刚石薄膜进行微细加工的反应离子刻蚀技术.提出了改善微机械加工效果的金属掩膜侧壁钝化概念,为MEMS器件的金刚石微结构集成制造开辟了更为精确有效的技术途径。
【Abstract】 CVD diamond film is a promising functional electronic material and has attracted increasing interest, but it is so extra-hard and chemically stable that it is difficult to be etched and fabricated. Thus, the technique of micromechanical machining of CVD diamond film is one of the key technique in MEMS applications. In this paper, the latest developments about this technique, such as selective deposition, replication processes, laser ablation and oxygen plasma etching and so on were introduced, and the technique of oxygen reactive ion etching used for CVD diamond film was discussed in detail. And the new concept of sidewall passivation was put forward. In this mechanism metal mask plays an important role in improving the characteristics of fabricated diamond structure. This process is recommended to be a more powerful technique for the diamond microstructure fabrication in MEMS.
- 【文献出处】 金刚石与磨料磨具工程 ,Diamond & Abrasives Engineering , 编辑部邮箱 ,2003年01期
- 【分类号】TB43
- 【被引频次】19
- 【下载频次】388