节点文献
不同粉末冶金工艺制造的CuCr触头的微观组织差异及对电性能的影响
Microstructures and Interrupting Behaviors of CuCr Contacts Made by P/M Manufacture Processes
【摘要】 评述了熔渗法和混粉烧结法两种粉末冶金工艺制备的 Cu Cr触头的微观结构差异及对电开断性能的影响。与熔渗法相比 ,烧结法制备的 Cu Cr触头具有更好的抗熔焊性能 ,更低的截流值和更好的吸放气性能 ,但因其机械强度较低故耐压可能不如熔渗法触头。对两种工艺提出了改进的建议
【Abstract】 Microstructure characteristics and their effects on interrupting behaviors were discussed for CuCr vacuum contact materials made by P/M sintering and infiltration processes. Compared with that of infiltration process, the contact made by sintering process shows better anti-welding ability, lower chopping current, and more excellent gas absorption ability, but its dielectric strength is not as good as that of infiltration CuCr contact duo to its relative low mechanical strength. Suggestions for further improvement of these contacts were also presented.
【关键词】 CuCr真空触头;
熔渗法;
烧结法;
微观结构;
电性能;
【Key words】 CuCr contact materials; sintering processes; infiltration processes; microstructure; switching behaviors;
【Key words】 CuCr contact materials; sintering processes; infiltration processes; microstructure; switching behaviors;
- 【文献出处】 电工材料 ,Electrical Engineering Alloy , 编辑部邮箱 ,2003年02期
- 【分类号】TF125
- 【被引频次】19
- 【下载频次】244